bonded pad
英 [ˈbɒndɪd pæd]
美 [ˈbɑːndɪd pæd]
【电】结合区
双语例句
- The ultrasonic bonds, after bonding and aging, of Au wire bonded on the Al metallization pad were analyzed by Scanning Electronic Microscopy ( SEM) with Energy Dispersive X-Ray Spectrometer ( EDX).
本文采用电子扫描电镜（SEM）及X射线能谱（EDX）分析了Au丝与Al金属化层焊盘键合后在老化过程中界面处元素的分布规律以及化合物的演变过程。 - From the present study, it is found that single crystal copper wires can be bonded on the gold pad and the aluminum pad by thermosonic ball bonding and wedge bonding without gas protection.
研究结果表明，在没有保护气氛的环境下，单晶铜丝可以热超声球键合和楔键合在金衬底和铝衬底上。